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Patent reveals Huawei's quad-chiplet rival for Nvidia's Rubin AI GPUs could use packaging tech that rivals TSMC — Ascend 910D rumors have seemingly solid foundation

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Huawei has reportedly developed a chip packaging process technology for its Ascend 910D processor that is comparable to TSMC’s leading-edge CoWoS technology.

Zdroj: https://www.tomshardware.com/pc-components/gpus/huaweis-quad-chiplet-rival-for-nvidias-rubin-ai-gpus-could-use-packaging-tech-that-rivals-tsmc-ascend-910d-rumors-have-seemingly-solid-foundation

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